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GRIPM Advanced Materials

MaterialsBeijing, ChinaFounded 2004· One of 1019 Materials companies tracked by AMPulse

Chinese state-owned enterprise specializing in design, R&D, production and sales of non-ferrous metal powder materials including copper-based powders, tin-based solder powders, and 3D printing metal powders.

CEO / Founder
Huijun He (贺会军)
Team Size
501-1000
Stage
Public
Total Funding
Publicly Traded
Latest Round
IPO
Key Investors
中国有研科技集团 (GRINM Group); 钢研投资有限公司 (Gangyan Investment)

Technology & Products

Key Products

Advanced copper-based metal powder materials; High-end microelectronic tin-based solder powder materials; 3D printing powder materials (aluminum alloys, titanium alloys, superalloys, copper alloys, tool steel, cobalt-chrome); Electronic paste materials; FeNi series soft magnetic powders; High thermal conductivity copper powders for GPU/thermal management

Technological Advantage

Proprietary spherical metal powder preparation technologies including inert gas atomization, centrifugal atomization, and electrode induction melting gas atomization (EIGA); 5000-ton annual spherical metal powder production capacity; 100+ authorized patents; National Science & Technology Progress Second Prize winner; Subsidiaries recognized as national-level "Specialized and New" (专精特新) "Little Giant" enterprises

Differentiation

Value Proposition

Vertically integrated non-ferrous metal powder supplier backed by state-owned GRINM group, offering high-purity spherical metal powders (aluminum, titanium, copper, nickel-based superalloys, tool steel, cobalt-chrome) for additive manufacturing, with 5000-ton annual powder production capacity and proprietary gas atomization technology.

How They Differentiate

As a subsidiary of state-owned GRINM (China's nonferrous metals R&D institution), the company has deep technological heritage, 100+ patents, national-level R&D platforms (Ministry-approved Metal Powder Materials Industrial Technology Research Institute), and a vertically integrated supply chain spanning copper, tin, and AM powders. The company went public on the STAR Market (科创板) in 2021, providing capital for expansion.

Market & Competition

Target Customers

Aerospace manufacturers, mold/die makers, automotive OEMs, medical device manufacturers, powder metallurgy companies, electronics/semiconductor packaging firms

Industry Verticals

Aerospace; Automotive; Medical; Electronics/Semiconductor; Mold & Die; Powder Metallurgy; Thermal Management

Competitors

中航迈特 (AVIMETAL); 江苏威拉里 (Jiangsu VILARY); 宁波众远 (Ningbo Zhongyuan)

Growth & Milestones

Growth Metrics

2025 revenue: ¥39.02B RMB (~$5.4B USD); 2025 net profit: ¥70.91M RMB (~$9.8M USD); 3D printing powder sales 271 tons in 2024 (202% YoY growth)

Major Milestones

2004: Company founded; 2018: Restructured as joint-stock company; 2021-03: Listed on Shanghai Stock Exchange STAR Market (科创板, ticker 688456); 2024: 3D printing powder sales reached 271 tons (202% YoY growth); 2025: Subsidiaries 有研纳微 and 有研增材 recognized as national-level "Specialized and New Little Giant" enterprises; 2026-03: Groundbreaking for 4580-ton/year AM metal powder production base in Binzhou, Shandong

Notable Customers

Aerospace engine manufacturers (aircraft engine repair, aerospace structural components); automotive OEMs; electronics/semiconductor packaging companies; MLCC manufacturers (nano nickel powder verification in progress)

Recent coverage of GRIPM Advanced Materials

AM patents

AM-relevant patents linked to this company.

Patents
6
Granted
2
Families
6

Leading domains: process (6), material (5)

Filings by year: 2023: 1 · 2022: 1 · 2019: 2 · 2018: 2

  1. A method for manufacturing a copper circuit board pattern by adding materials109246939 · CN
  2. Preparation method of aluminum oxide dispersion strengthening copper alloy part110238397 · CN
  3. Method for manufacturing packaging or coating ceramic pieces by metal additives109128151 · CN
  4. Spherical composite powder and preparation method thereof115805305 · CN
  5. Titanium/aluminum dissimilar metal component and laser additive manufacturing method thereof117102503 · CN

Funding rounds

  • IPO¥3.2亿元 (approx $45.3M)2021-03Lead: Shanghai Stock Exchange STAR Market · Source